According to news on June 12, Japanese materials manufacturer Denki Glass recently announced the launch of a new semiconductor substrate material GC Core (Glass-Ceramics, glass ceramics). Compared with traditional organic substrates, glass substrates have better performance in terms of flatness, thermal stability and mechanical stability. Currently, leading semiconductor companies including Intel and Samsung are also developing glass substrate packaging technology.
Specifically, glass substrates significantly improve electrical and mechanical properties, are stiffer and less susceptible to deformation, making it easier to run more wires through them; have tunable modulus and CTE closer to silicon, supporting Large form factor, supports up to 240mm x 240mm circuit boards; feature scaling with improved dimensional stability; can increase through-hole (TGV) density by about 10 times, improved routing and signals; low loss, high-speed signals; supports higher temperatures Advanced integrated power supply, etc.
Although glass substrates have many advantages, the glass material itself also has some disadvantages. For example, the brittleness of glass limits its application on substrates to a certain extent. For example, cracks are prone to occur when drilling holes on glass substrates using common CO2 lasers, which may eventually lead to the substrate breaking. Therefore, if you want to avoid this problem, you need to use an etching process to make holes instead. Not only is this solution technically more cumbersome, it will also incur additional costs.
Therefore, the GC Core glass ceramic substrate material developed by Electric Glass this time is made of Glass powder and ceramic powder are co-fired at low temperature. It has some properties of ceramic and is not prone to cracks. CO2 laser drilling can be used directly to reduce mass production costs. Not only that, substrates using GC Core glass ceramic substrate materials have lower dielectric constants and polarization losses, which can reduce signal attenuation in ultra-fine circuits and improve circuit signal quality. Therefore, the substrate produced by Denki Glass GC Core glass ceramic substrate material is stronger than the traditional glass substrate and can further reduce the thickness of the substrate.
Electrical Glass can also customize GC Core substrates according to the needs of semiconductor customers. Currently, it can We produce three types of products: standard low dielectric constant type, high thermal expansion coefficient type and high mechanical strength type. In this regard, Electric Glass stated that the company has successfully produced 300x300mm square GC Core glass ceramic substrate materials, and aims to expand the size to 510x510mm by the end of 2024.
Editor: Core Intelligence - Rurouni Sword
